Samsung Electronics wins $200 billion Broadcom AI chip partnership

Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030. Winning long-term production commitments from Broadcom, one of the world’s leading custom AI chip designers, could boost utilisation ‌at Samsung’s ⁠advanced ⁠manufacturing facilities to pull ahead in the race to supply AI chips.The deal provides for Broadcom’s next-generation communications chips, designed for high-speed data transfer, to be made with Samsung’s sub-2-nanometre process technology. The partnership could help strengthen Samsung’s foundry business, as it seeks to narrow the gap with industry ⁠leader TSMC by wooing major technology customers. Should TSMC be worried with SamSung rise ?